Silicon dioxide SiO2 Evaporation Materials

Applications of SiO2 compounds in laboratory and industry and steps for laboratory evaporative coating

Applications of Silicon Dioxide (SiO2) Compounds

Silicon dioxide (SiO2) is an inorganic compound that is widely used in laboratories and industry, mainly in the form of quartz, glass and silica.

Laboratory Applications:

Optical components: SiO2 is used in the manufacture of optical lenses, prisms and optical fibers due to its high transparency and low refractive index.

Labware: Quartz glass has excellent heat resistance and chemical stability, and is commonly used in the manufacture of labware such as beakers, test tubes and crucibles.

Thin Film Materials: SiO2 films are used in the preparation and surface protection of electron microscope samples.

Industrial Applications:

Semiconductor industry: SiO2 is widely used in the manufacture of integrated circuits and microelectronic devices as an insulating layer and doping mask.

Building materials: SiO2 is used in the manufacture of high-strength glass, ceramics and concrete additives to enhance the durability and strength of materials.

Coatings and fillers: SiO2 nanoparticles are used as fillers in coatings and plastics, providing excellent abrasion resistance and UV resistance.

Food and Pharmaceuticals: SiO2 is widely used in food additives and pharmaceutical preparations as anti-caking agents and drug carriers.

Detailed steps for laboratory evaporation coating

Preparation:

Substrate cleaning:

Ultrasonic cleaning: Use ultrasonic cleaner to remove oil and particles on the surface of the substrate.

Solvent Cleaning: Use a suitable solvent (e.g. ethanol or acetone) to further clean the substrate surface.

CY Plasma Cleaning: Plasma cleaning is performed using CY plasma cleaning equipment. Plasma cleaning removes organic contaminants and oxidized layers from the surface of the substrate by generating high-energy plasma to improve the hydrophilicity and adhesion of the substrate surface. The specific steps are as follows:

Load the substrate: Place the substrate on the sample table of the CY plasma cleaning equipment.

Vacuum extraction: Start the vacuum pump to extract the air from the cleaning chamber to reach the required vacuum level.

Plasma Cleaning: Start the plasma generator, select the appropriate gas (such as oxygen or argon), adjust the power and time for plasma cleaning.

Cooling and Removal: After the cleaning is completed, turn off the plasma generator and remove the substrate after it has cooled down.

Vacuum extraction:

Vacuum Chamber: Place the substrate and coating material in the vacuum chamber, use mechanical and molecular pumps to extract the air from the chamber to achieve a high vacuum (usually below 10^-6 Torr).

Heating for evaporation:

Resistance heating:

Installation of resistor wire: a resistor wire (e.g., tungsten wire) is installed on the evaporation source and the coating material is placed on the wire.

Heating: Electricity is applied to heat the resistance wire to gradually increase its temperature until the coating material begins to evaporate. Resistance heating is suitable for the evaporation of low melting point materials.

Temperature control: The temperature of the resistance wire is precisely controlled by adjusting the current and voltage to ensure uniform evaporation of the coating material.

Electron beam heating:

Installation of coating material: Place the coating material in the crucible of the electron beam evaporation source.

E-beam Generator: Start the E-beam generator, the electron beam is focused and accelerated by an electromagnetic field to impact the surface of the coating material.

Heating and Evaporation: The high energy of the E-beam causes the coating material to rapidly heat up and evaporate. E-beam heating is suitable for evaporation of high melting point materials.

Controlling the Electron Beam: By adjusting the power and scanning speed of the electron beam, the evaporation rate of the coated material is precisely controlled.

Deposition of the film:

Evaporation Diffusion: The evaporated material diffuses in a vacuum and condenses on the surface of the substrate to form a uniform film. By adjusting the temperature and position of the substrate, the crystalline structure and adhesion of the film can be controlled.

Film Thickness Control: By monitoring the evaporation rate and time, the thickness of the film is precisely controlled using a quartz crystal monitor or an optical monitor. Thickness control is especially important for optical coatings and electronics manufacturing.

Cooling and Removal:

Cooling: Turn off the heaters and allow the substrate to cool to room temperature. Avoid contamination of the substrate surface during cooling.

Removal: Open the vacuum chamber and remove the coated substrate for subsequent processing or testing. The coated substrate usually requires surface analysis and performance testing to ensure that the coating quality meets the requirements.

Silicon dioxide films are used in a wide range of applications such as optical coatings, semiconductor industry, decorative coatings and functional coatings.

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