Lab Front door desktop vacuum evaporation coater for coat aluminum film

This equipment is a small desktop thermal evaporation coater especially designed for high vacuum, it can provide a maximum of 100A coating current,the maximum evaporating temperature up to 1800℃,and can meet the evaporation of a variety of common metal and part of non-metal.

 The vacuum chamber is made of stainless steel and has been degassed before delivery. It can reach the limit vacuum of 5x10-4Pa with the molecular pump group, which can meet the vacuum environment required by the evaporation of most materials. 

The vacuum chamber is opened by front door to facilitate lofting. The chamber is equipped with an adaptive observation window with a baffle for observing the coating process. The baffle can effectively prevent the observation window from being polluted by the film material.

 Product Features:

High purity film: Because it is carried out under high vacuum conditions, the collision between gas molecules and the evaporating material is reduced, so that high purity film can be prepared.

Precise control: Evaporation coating technology allows for precise control of the thickness, composition and structure of the film, which is essential in many

high-precision applications：

Suitable for a wide range of materials: Evaporation coating technology can be used for a wide range of materials, including metals, alloys, oxides, carbides, nitrides, as well as organic materials.

High deposition rate: Especially when using electron beam evaporation, high deposition rate can be achieved due to the high energy electron beam's ability to quickly heat the material.

Uniformity: With proper adjustment of process parameters, a uniform film can be obtained on a large area substrate.

Low damage: Because the heating is mainly concentrated on the evaporating material, the thermal effect on the substrate is small, suitable for the film deposition of

heat-sensitive materials.

Buy Information : 

If you are interested in our evaporative coater, please contact us for more information and quotation.

 Contact number: 183-3926-3857

E-mail: jack@cysitech.com

Contact: Jack Yang  

Wechat: 183 3926 3857 

Technical Parameters:

Application field:

Evaporation coating technology is widely used in the electronics industry, including the following aspects:

Integrated circuit manufacturing: In the manufacturing process of integrated circuits, evaporation coating technology is used to deposit metal interconnect layers and diffusion barrier layers. The metal interconnect layer (such as aluminum, copper) is used to connect different parts of the circuit, and the diffusion barrier layer (such as titanium nitride) is used to prevent the diffusion of metal atoms at high temperatures, ensuring the stability and reliability of the circuit.

Touch screen and display: In the manufacture of touch screen and display, evaporation coating technology is used to deposit thin films of transparent conductive oxides such as indium tin oxide, ITO.

Preparation of conductive layer and isolation layer: electron beam evaporation coating technology is used to prepare conductive film layer in the field of semiconductor and microelectronics device manufacturing, such as functional components such as electrodes and contacts for semiconductor devices, to improve the conductive performance and stability of devices.

Manufacture of high-performance films: Electron beam evaporation technology enables the production of high-performance films with wear resistance and high temperature resistance, which can be used in the aerospace industry, as well as as hard coatings in the cutting and tool industries.

Application Case "Evaporation coating equipment to coat aluminum film on silicon wafer sample"

The experimental steps for deposition of aluminum films on silicon wafer samples using evaporation coating equipment usually include the following process.

Please note that these steps may vary depending on the specific device and experimental requirements:

1. Prepare Sample:

Clean silicon wafer:Clean the wafer with solvents (e.g., acetone, isopropyl alcohol) and deionized water to remove surface impurities.

Air dry with nitrogen or in a clean environment.

Check the equipment:Make sure the evaporation coating equipment is in working condition.

Ensure that the quality of the evaporating material (aluminum) meets the experimental requirements.

2. Load the sample:

Install silicon wafer:Place the cleaned silicon wafer on the sample rack, making sure it is firm and in place.The sample holder can be rotated to ensure uniform deposition.

Loading evaporation material:Place the aluminum material in an evaporation source such as a tungsten boat or tungsten wire.

3. Vacuum extraction:

Start the vacuum pump:Turn on the vacuum system and extract the air in the coating chamber to reach the required low pressure environment (usually 10^-5 torre or less).

4. Evaporation coating:

Heating evaporation source:Slowly heat the aluminum to evaporate it.Control the heating rate to avoid uneven deposition due to rapid evaporation.

Monitoring film thickness:Use a quartz crystal monitor or other film thickness monitoring device to measure the film thickness in real time, and stop heating when the desired thickness is reached.

5.Cooling and ventilation:

Cooling sample:Allow the sample to cool in a vacuum to reduce thermal stress and oxidation.

Through inert gas:Slowly pass nitrogen or argon to return to normal pressure.

6.Unload the sample:

Remove the silicon wafer:

Open the vacuum chamber and carefully remove the coated silicon to avoid contamination and scratches.

Check film quality:Use an optical microscope or other analytical instrument to check the uniformity and adhesion of the film.

7. Clean the device

Clean evaporation source:Clean up residual aluminum and other impurities in preparation for the next experiment.

Maintenance of vacuum system:Check and maintain vacuum pump and related accessories.

Matters needing attention

Safety protection:Wear appropriate personal protective equipment, such as gloves and goggles.

Environmental control:Operate in a clean room or dust-free environment to reduce particle contamination.These steps provide a basic guide, and specific operations may need to be adjusted according to the equipment manual and experimental design.