E-mail: cysi@cysi.wang
This equipment is an electron beam coating equipment, which is mainly composed of an electron beam coating system and an electrical control system. The system is mainly used for the preparation of various metal films, compound films, insulating films, dielectric films, semiconductor films and other single-layer/multilayer films and ferromagnetic material films. It can also be used to prepare alloy films, compound mixed films and film doping
This equipment is an electron beam coating equipment, which is mainly composed of an electron beam coating system and an electrical control system. The system is mainly used for the preparation of various metal films, compound films, insulating films, dielectric films, semiconductor films and other single-layer/multilayer films and ferromagnetic material films. It can also be used to prepare alloy films, compound mixed films and film doping.
High-purity film: Since the evaporation process is carried out in a vacuum environment, there are few pollutants, so high-purity films can be obtained.
High evaporation rate: Electron beam evaporation usually has a high evaporation rate and can form thin films quickly.
Wide material compatibility: It can handle a variety of materials, including metals, alloys, semiconductors, insulators, etc. It is suitable for evaporating refractory materials (such as tungsten, tantalum) and low vapor pressure materials.
Precise control: The film thickness, deposition rate and surface morphology can be precisely controlled, which is suitable for applications requiring precise thickness control.
Excellent adhesion: Since the evaporated particles have high energy, films with excellent adhesion can be produced.
Uniformity: Suitable for large-area coating, with good film thickness uniformity.
Low energy consumption: Compared with other deposition methods, electron beam evaporation has relatively low energy consumption.
Flexibility: Multilayer film deposition can be performed, and different levels of deposition can be achieved by adjusting the evaporation material.
No plasma damage: Since electron beam evaporation does not rely on plasma, it causes less damage to the substrate and is suitable for the deposition of heat-sensitive or fragile materials.
Purchase information:
If you are interested in our e-beam evaporation coater, please contact us for more information and quotes.
Contact number: 156 3719 8390
Email: shirley@cysitech.com
Contact person: shirley
WeChat: 18736046549
Name | High vacuum electron beam evaporation coating instrument | |
Model | CY-EBH500-SS | |
Sample stage | Dimensions | <150mm, rotatable |
Adjustable Temperature | ≦500℃ | |
Electron Gun | E-type, 6 crucibles | |
Vacuum chamber | Dimension | Φ500*H500mm |
Observation window | diameter φ100mm | |
Material | 304 stainless steel | |
Open method | Front-opening door | |
Film Thickness Measurement | Crystal film thickness monitor with less than 6% non-uniformity | |
Vacuum system | Pre-pump | Two-stage rotary vane pump, pumping speed 1.1L/S |
Secondary pump | Turbomolecular pump, pumping speed 600L/S | |
Vacuum Measurement | Composite vacuum gauge (ion gauge + resistance gauge) | |
System vacuum | 5×10^-5 Pa | |
Cooling System | Water cooling system with pressure monitoring | |
Lighting | One neon lamp | |
Electrode Interface | 2 metal evaporation electrode interfaces | |
Control System | CYKY self-developed professional-grade controller | |
Other parameter | Power supply | AC380V,50Hz |
Dimension | 1000mm×800mm×1500mm | |
Main parts:
Name | Description |
Main machine | High vacuum electron beam evaporation coating instrument |
Water chiller | 1. Equip the molecular pump, evaporation electrode, and electron gun with independent water inlet and outlet to ensure long-term stable operation of the equipment; 2. The total water inlet is equipped with a water temperature and water pressure detection device to detect the water temperature and water pressure status and perform abnormal alarms 3. The total water inlet and outlet use a standard waterway pagoda interface to connect the user's on-site water supply system |
Molecular pump unit | 1. Vacuuming: The molecular pump can quickly reduce the pressure in the vacuum chamber to achieve the required high vacuum state, which is an indispensable condition in the electron beam evaporation process. 2. Maintain vacuum stability: During the coating process, the molecular pump continues to operate to maintain a stable vacuum in the vacuum chamber to ensure the uniformity and quality of the coating. 3. Remove gas impurities: The molecular pump can effectively remove residual gas and steam in the vacuum chamber to prevent these impurities from affecting the purity and performance of the film. 4. Improve deposition rate and quality: Under high vacuum conditions, the evaporation rate of electron beam evaporation materials and the deposition rate of thin films can be improved, and the crystal quality and adhesion of the film will also be better. |
Electron gun and power supply | 1. E-type electron gun The 270° deflection angle of the electron gun ensures that the electron beam emission source material does not pollute the film layer; The bidirectional and fast electron beam scanning system and scanning circuit avoid the "pitting" problem of the target material; The precise water channel design ensures that the temperature rise of the electron gun is small and can work stably for a long time; The crucible station of the electron gun evaporation source is 6 holes; 2. Electron gun power supply: 10kW; 3. Electron gun baffle: pneumatic; |
Random accessory | Related auxiliary tools, such as copper washers, O-rings, standard parts, etc. |
User manual | One piece |
Semiconductor industry: used to manufacture integrated circuits, microelectronic devices, etc. Electron beam evaporation can accurately control the thickness and composition of the film and is one of the key manufacturing processes.
Optical devices: used to coat optical films, such as anti-reflective films, high-reflective films, filters, etc., used in lenses, glasses, optical instruments and other equipment.
Decorative coatings: used for surface decoration of products such as watches, jewelry, and mobile phones, providing a variety of colors and surface effects, while having wear resistance and corrosion resistance.
Functional coatings: used to manufacture coatings with special functions such as anti-scratch, anti-fingerprint, and corrosion resistance, and used in display screens, touch screens and other equipment.
Energy field: used to deposit thin film materials in solar cell manufacturing to improve photoelectric conversion efficiency.
Aerospace: used to manufacture high-performance coatings to improve the material's high temperature resistance, oxidation resistance and wear resistance.
Biomedicine: used to manufacture coatings for biosensors, implants and other medical devices, providing biocompatibility and antibacterial properties.
Application Case (Preparation of Metal Electrodes of Two-Dimensional Materials)
1. Preparation:
Material preparation: Select appropriate two-dimensional materials (such as graphene, transition metal disulfide, etc.) and metal materials (such as gold, silver, chromium, etc.) as electrode materials.
Substrate cleaning: Clean the substrate to be coated (such as silicon wafer, glass, etc.) to remove organic and inorganic impurities on the surface. Common cleaning methods include solvent cleaning, ultrasonic cleaning and plasma cleaning.
2. Loading samples:
Sample fixation: Place the cleaned substrate on the sample stage of the coating instrument and ensure that it is firmly fixed.
Loading coating materials: Place the metal material in the crucible of the electron beam evaporation source.
3. Vacuum treatment:
Evacuation: Start the vacuum pump system to reduce the pressure in the vacuum chamber to the required high vacuum level (usually10 −6 to 10−8 Torr).
4. Evaporation coating:
Heating the evaporation source: Use the electron beam to heat the metal material in the evaporation source to evaporate it.
Controlling the coating rate: Control the thickness of the metal film by monitoring and adjusting the evaporation rate. Use a quartz crystal monitoring instrument to monitor the film thickness in real time.
Depositing metal: Metal vapor is deposited on the substrate to form a metal electrode. A uniform film can be obtained by rotating the sample stage.
5. Post-processing:
Cooling and ventilation: Stop electron beam heating, wait for the sample to cool to room temperature, and then slowly introduce gas to restore atmospheric pressure.
Remove the sample: Remove the sample from the vacuum chamber for further analysis and processing.
6. Subsequent processing (optional):
Annealing: For some materials, annealing may be required to improve the crystal structure and conductive properties of the film.
Photolithography or etching: As needed, the metal electrode is patterned using photolithography technology to form the desired electrode structure.
7. Characteristic evaluation:
Electrical performance test: Electrically test the prepared metal electrode to evaluate its conductive properties, contact resistance, etc.
Microstructural analysis: Use a microscope (such as SEM, AFM, etc.) to observe the surface morphology and thickness uniformity of the film.
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