Desktop Vacuum Thermal Evaporation Coater machine for deposition Ti and Au for contacts

The physical process of evaporation coating mainly includes material evaporation, transport of gaseous particles, and deposition on the substrate to form a film. During evaporation, the material must gain enough thermal energy to overcome the intermolecular binding energy, allowing it to transition into gaseous molecules and escape from the surface of the evaporation source. These gaseous particles travel in a straight line to the substrate surface with little to no collisions and condense to nucleate and grow into a solid-phase thin film.

Product Features:

• High-Purity      Films: Conducted under high      vacuum conditions, evaporation coating reduces collisions between gas      molecules and the evaporated material, enabling the preparation of      high-purity films.

• Precise Control: Evaporation coating technology allows for      precise control over the thickness, composition, and structure of the      film, which is crucial for many high-precision applications.

• Versatility: This technology can be applied to a wide range      of materials, including metals, alloys, oxides, carbides, nitrides, and      organic materials.

• High      Deposition Rate: Especially      when using electron beam evaporation, the high-energy electron beam can      rapidly heat materials, achieving a high deposition rate.

• Uniformity: With appropriate process parameter adjustments,      it is possible to obtain uniform films on large-area substrates.

• Low Damage: Since heating is mainly concentrated on the      evaporated material, the thermal impact on the substrate is minimal,      making it suitable for film deposition on heat-sensitive materials.

Purchase information：

·         If you are interested in our e-beam evaporation coater, please contact us for more information and quotes.

·         Contact number: 156 3719 8390

·         Email: shirley@cysitech.com

·         Contact person: shirley

·         WeChat: 18736046549

 Main parts: 

 Application Areas

Evaporation coating technology is widely used in the electronics industry, including the following areas:

·         Integrated Circuit Manufacturing: In the manufacturing of integrated circuits, evaporation coating technology is used to deposit metal interconnect layers and diffusion barrier layers. Metal interconnect layers (such as aluminum and copper) connect different parts of the circuit, while diffusion barrier layers (such as titanium nitride) prevent metal atoms from diffusing at high temperatures, ensuring the stability and reliability of the circuit.

·         Touch Screens and Displays: In the production of touch screens and displays, evaporation coating technology is used to deposit thin films of transparent conductive oxides, such as indium tin oxide (ITO).

·         Preparation of Conductive and Insulating Layers: Electron beam evaporation coating technology is used in the manufacturing of semiconductors and microelectronic devices to prepare conductive thin film layers, such as electrodes and contacts for semiconductor devices, improving the conductivity and stability of the devices.

·         Manufacturing of High-Performance Films: Electron beam evaporation technology can produce high-performance films with wear and high-temperature resistance. These films are used in the aerospace industry and as hard coatings in the cutting and tooling industries.

Application Case: "Aluminum Coating on Silicon Wafer Using Evaporation Coating Equipment"

The experimental steps for aluminum film deposition on silicon wafer samples using evaporation coating equipment generally include the following processes. Note that these steps may vary depending on the specific equipment and experimental requirements:

1.      Preparation

• Clean the Silicon Wafer:

• Clean the silicon wafer with        solvents (such as acetone and isopropanol) and deionized water to remove        surface impurities.

• Dry with nitrogen blow or allow        to air dry in a clean environment.

• Check the Equipment:

• Ensure the evaporation coating        equipment is in normal working condition.

• Verify that the quality of the        evaporated material (aluminum) meets the experimental requirements.

2.      Loading the Sample

• Install the Silicon Wafer:

• Place the cleaned silicon wafer        on the sample holder, ensuring it is secure and in the proper position.

• The sample holder can rotate to        ensure uniform deposition.

• Load the Evaporation Material:

• Place the aluminum material in        the evaporation source (such as a tungsten boat or tungsten filament).

3.      Vacuum Extraction

• Start the Vacuum Pump:

• Turn on the vacuum system to        evacuate the air in the coating chamber, reaching the required        low-pressure environment (usually at 10^-5 Torr or lower).

4.      Evaporation Coating

• Heat the Evaporation       Source:

• Gradually heat the aluminum        material to evaporate it.

• Control the heating rate to        avoid uneven deposition due to rapid evaporation.

• Monitor Film Thickness:

• Use a quartz crystal monitor or        other thickness monitoring device to measure film thickness in        real-time. Stop heating once the desired thickness is achieved.

5.      Cooling and Venting

• Cool the Sample:

• Allow the sample to cool in        vacuum to reduce thermal stress and oxidation.

• Introduce Inert Gas:

• Slowly introduce nitrogen or        argon to return to atmospheric pressure.

6.      Unloading the Sample

• Remove the Silicon Wafer:

• Open the vacuum chamber and        carefully remove the coated silicon wafer, avoiding contamination and        scratching.

• Check Film Quality:

• Use an optical microscope or        other analytical instruments to check the uniformity and adhesion of the        film.

7.      Clean the Equipment

• Clean the Evaporation       Source:

• Remove residual aluminum and        other impurities to prepare for the next experiment.

• Maintain the Vacuum       System:

• Inspect and maintain the vacuum        pump and related components.

Precautions

• Safety Protection: Wear appropriate personal protective equipment, such as      gloves and safety goggles.

• Environmental Control: Operate in a clean room or dust-free environment to reduce      particle contamination.

These steps provide a basic guide, and specific operations may need to be adjusted according to the equipment manual and experimental design.