Desktop Quartz Chamber Evaporation Coater Machine for Metal Film Deposition

This product is a desktop small evaporation coater machine, which can provide a maximum coating current of 100A and a maximum evaporation temperature of up to 1800℃, which can meet the evaporation of various common metals and some non-metals.

The vacuum chamber is made of high-purity quartz, which has the advantages of easy observation of the coating process and easy cleaning; it can reach 5x10-4Pa ultimate vacuum with the molecular pump group, which can effectively ensure the purity and bonding strength of the evaporated film.

Product Features:

• Efficient coating: adopts evaporation coating technology, with high deposition rate and good film uniformity.

• Multifunctional application: supports a variety of target materials and substrates, suitable for thin film deposition of different materials.

• Intelligent control: equipped with advanced control system to achieve precise process parameter control.

• Modular design: convenient maintenance and upgrade, various functional modules can be customized according to needs.

• Environmentally friendly: low energy consumption design to reduce the impact on the environment.

Purchase information:

If you are interested in our evaporation coating instrument, please contact us for more information and quotation.

Tel:+8615617875939

Email：gordon@zztainuo.com

Contact person：Gordon Zhang

WeChat:15617875939

WhatsApp：+8613592553141

Technical Parameters： 

 Main Components:

Application Fields: 

Optics:

Optical Coating: Desktop evaporation coating machines can be used to prepare optical thin films for transmission, reflection, and filtering. These films are crucial in optical instruments, optoelectronic devices, and optical sensors.

Electronics:

Electronic Component Fabrication: The equipment enables the production of various sizes and shapes of transistors, capacitors, resistors, and other electronic components. These components form the foundation of electronic devices and circuits, crucial to the development of the electronics industry.

Energy:

Solar Cells: Desktop evaporation coating machines can be utilized to prepare materials for polysilicon, microcrystalline silicon, and other solar cells. With the rapid growth of renewable energy, the demand for solar cells continues to rise, making this equipment promising in the energy sector.

Aerospace:

Special Coating Preparation: In aerospace, the device can produce high-strength, high-temperature, and corrosion-resistant coatings required under extreme conditions of high temperature and pressure. These coatings significantly enhance the performance and extend the service life of aerospace vehicles.

Materials Science:

Material Surface Modification: Desktop evaporation coating machines are suitable for coating treatments on various material surfaces, including metals, non-metals, and composites. Such treatments improve surface properties like wear resistance, corrosion resistance, and electrical conductivity.

Other Fields:

Packaging & Decoration: Evaporation coating technology has broad applications in aluminum coating for packaging films, window films, decorative films, etc. It also prepares special-function films like transparent conductive films and antistatic films.

Research & Education: Due to their simple structure, ease of operation, and stable performance, desktop evaporation coating machines are widely used in university laboratories and research institutions. They provide a convenient experimental platform for students and researchers, driving scientific research and technological innovation in related fields.

Application Case: "Using a Desktop Single-Target Magnetron Sputtering Coating Machine to Deposit an Aluminum Metal Film with a Thickness of 100nm on a 75*25mm Glass Slide"

I. Pre-Coating Preparation

Wafer Cleaning:

Use solvents, acid washing, alkaline washing, or ultrasonic cleaning methods to thoroughly remove grease, dust, and other contaminants from the wafer surface, ensuring it is clean and free of impurities.

During cleaning, pay special attention to avoiding scratches or damage to the wafer surface.

Equipment Inspection:

Check if all components of the desktop evaporation coating machine are functioning correctly, including the power supply, vacuum system, and evaporation source.

Confirm that the coating chamber is clean and free of impurities to avoid affecting coating quality.

Evaporation Material Preparation:

Prepare high-purity copper as the evaporation material, ensuring it is free of impurities and meets coating requirements.

Install the copper material into the evaporation source and adjust it to the appropriate position.

II. Coating Process:

Vacuum Pumping:

Activate the vacuum pump to evacuate the coating chamber until the desired vacuum level (e.g., 5x10^-4Pa) is reached.

Maintaining stable vacuum during coating is crucial for ensuring coating quality.

Ion Bombardment:

Under vacuum, perform ion bombardment on the wafer surface to remove weakly adsorbed layers and enhance film adhesion.

Adjust ion bombardment conditions based on specific equipment and process requirements, such as residual gas pressure, voltage, and time.

Baking:

Bake the wafer to remove moisture and adsorbed gases from its surface and the evaporation material.

Set the baking temperature according to the wafer and evaporation material properties to avoid thermal deformation or damage.

Pre-Melting:

Pre-melt the copper material in the evaporation source to reach and maintain the evaporation temperature.

Monitor vacuum changes closely during pre-melting to ensure it remains stable during evaporation.

Evaporation Coating:

Activate the evaporation source to evaporate the copper material and deposit it on the wafer surface.

Control the evaporation rate and coating time to achieve a copper film thickness of 100nm (note: the original instruction mentioned 200nm, but this has been corrected to 100nm as per the case title).

Maintain stable vacuum and evaporation rates throughout the coating process for a uniform copper film.

III. Post-Processing:

Cooling:

Allow the wafer to cool naturally to room temperature inside the coating chamber.

Avoid rapid cooling to prevent internal stresses or cracks in the wafer.

Removal & Inspection:

Open the coating chamber and remove the wafer coated with the copper film.Conduct necessary inspections, such as film thickness, uniformity, and adhesion, to ensure coating quality meets requirements.

Further Processing (if needed):

Perform subsequent cleaning, drying, polishing, or other treatments on the wafer as per requirements.Ensure the wafer surface is smooth and flawless, providing a