Magnetron sputtering coater instrument with adjustable distance between magnetron target and sample stage

magnetron sputtering coater machine with adjustable distance between the magnetron target and sample stage can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, polytetrafluoroethylene films, and more. Compared with similar equipment, this three-target magnetron sputtering coater machine is not only widely applicable but also compact and easy to operate, making it an ideal device for laboratory preparation of material films。 

Magnetron Sputtering Coater Product Features：

Efficient Coater: Utilizing magnetron sputtering technology, it offers high deposition rates and excellent film uniformity.

Multi-functional Application: Supports various target and substrate materials, suitable for depositing films of different materials.

Intelligent Control: Equipped with an advanced control system for precise process parameter control.

Modular Design: Easy to maintain and upgrade, with customizable functional modules as per requirements.

Eco-friendly: Low energy consumption design reduces environmental impact. 

Magnetron Sputtering Coater Purchase Information:

If you are interested in our magnetron sputtering Coater system, please contact us for more information and a quote.

Phone: 156 3719 8390

Email: shirley@cysitech.com

Contact Person: Shirley

WeChat: 18736046549 

Magnetron Sputtering Coater Technical Parameters:

Magnetron Sputtering Coater The main components：

Application Fields:

Optical Films: Manufacturing optical devices such as anti-reflection coatings, reflective films, and filters.

Electronics and Semiconductors: Used in the production of integrated circuits and electronic components, including resistors, capacitors, etc. Applied in the metallization process of semiconductor devices, such as the deposition of conductive films of aluminum, copper, etc.

Hard Coatings: Producing hard coatings for industrial tools like cutters and molds, such as TiN and TiC, to enhance hardness and wear resistance.

Magnetic Materials: Manufacturing magnetic recording media, such as hard disks and magnetic heads.

Decorative Coatings: Creating decorative coatings for items like watches, jewelry, and eyeglass frames, to provide color and corrosion resistance.

Protective Coatings: Manufacturing protective coatings against corrosion, oxidation, and wear, such as protective coatings for metal parts.

Energy Materials: Deposition of films for energy devices like solar cells and fuel cells.

Sensors: Manufacturing sensitive films for various sensors, such as gas sensors and biosensors.

Application Example (Depositing Ag/Sn Alloy Film on Silicon Carbide (SiC) Substrate)

1.Substrate Preparation:

 A. Selection and Cleaning of Substrate

Selection of Substrate: Choose high-quality SiC substrate.

Cleaning: Ultrasonically clean the substrate sequentially with acetone, isopropanol, and deionized water to remove surface contaminants. Finally, blow dry with nitrogen gas. 

B. Surface Treatment

Surface Treatment:Perform plasma cleaning or thermal treatment to enhance adhesion between the film and the substrate.

2.Target Material Preparation:

Preparation of Target Material: Prepare high-purity silver (Ag) and tin (Sn) targets.

Target Cleaning: Polish the target surface with fine sandpaper to remove the oxide layer, then clean with acetone and isopropanol.

3.Magnetron Sputtering Equipment Preparation :

A. Vacuum Chamber Preparation

Cleaning the Vacuum Chamber:Ensure the vacuum chamber is clean and free of contaminants.

Loading Substrate and Target: Load the cleaned SiC substrate and Ag and Sn targets into the sputtering chamber. 

B. Vacuum System

Vacuuming: Start the vacuum pump to evacuate the sputtering chamber to a high vacuum state (usually below 10^-6 Torr).

4.Film Deposition :

A. Pre-sputtering

Pre-sputtering: After introducing the working gas (such as argon), pre-sputter the target to clean its surface and stabilize the sputtering process. 

B. Co-sputtering Deposition

Adjusting Power:Adjust the sputtering power of the Ag and Sn targets according to the desired alloy composition ratio. For example, if a 50% Ag and 50% Sn alloy is required, adjust the sputtering rates of both to achieve the corresponding ratio.

Deposition: Under stable sputtering conditions, start depositing the Ag/Sn alloy film on the SiC substrate. Control the gas flow and pressure to ensure uniform deposition.

5.Film Thickness and Composition Control:

Thickness Monitoring: Use a quartz crystal monitor or other thickness monitoring equipment to real-time monitor the film thickness to ensure the required thickness is achieved.

Composition Analysis: Use energy dispersive X-ray spectroscopy (EDS) or other composition analysis methods to detect the composition ratio of the film in real-time or subsequently.

6.Post-treatment :

A. Annealing Treatment

Annealing: Perform annealing treatment on the deposited film in a nitrogen or argon environment to improve the film's crystallinity and adhesion. The annealing temperature and time are set according to the film requirements.

7.Quality Inspection:

Structural Characterization: Use X-ray diffraction (XRD) to analyze the crystal structure of the film.

Surface Morphology:Observe the surface morphology of the film using a scanning electron microscope (SEM).

Composition Analysis: Use energy dispersive X-ray spectroscopy (EDS) or X-ray photoelectron spectroscopy (XPS) to analyze the chemical composition of the film.

8.Performance Testing:

Adhesion Testing:Perform scratch tests or tensile tests to evaluate the adhesion between the film and the substrate.

Electrical Properties: Measure the electrical properties of the film, such as resistivity and conductivity.

Thermal Properties:Test the thermal stability and thermal conductivity of the film.