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High Vacuum Magnetron Sputtering Coater for Ceramic film with UPS Power SupplyHigh Vacuum Magnetron Sputtering Coater for Ceramic film with UPS Power SupplyHigh Vacuum Magnetron Sputtering Coater for Ceramic film with UPS Power SupplyHigh Vacuum Magnetron Sputtering Coater for Ceramic film with UPS Power SupplyHigh Vacuum Magnetron Sputtering Coater for Ceramic film with UPS Power Supply

High Vacuum Magnetron Sputtering Coater for Ceramic film with UPS Power Supply

     High Vacuum Magnetron Sputtering Coater can be used to prepare single or multilayer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, etc

The magnetron sputtering coater is an advanced physical vapor deposition (PVD) equipment widely used in semiconductors, optoelectronics, display technology, and surface engineering. This equipment adopts magnetron sputtering technology, which enhances ionization efficiency through a magnetic field to achieve high-quality and uniform film deposition. The magnetron sputtering coater with UPS is a high-cost-performance equipment independently developed by our company, featuring standardization, modularization, and customization. It can protect against power outages, ensure continuous stable operation, and is particularly suitable for environments with unstable current voltage or continuous temperature requirements. This equipment can be used to prepare single or multilayer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, etc. The three targets can meet the needs of multilayer coatings. Compared to similar equipment, the three-target magnetron sputtering coater not only has a wide range of applications but also features a small volume and easy operation. It is an ideal device for laboratory material film preparation. The built-in UPS can avoid experimental interruptions caused by power outages, making it more stable.

Product Features:

Power Outage Prevention: During a power outage, the UPS power supply can provide continuous power, ensuring normal operation and preventing production interruptions and losses.

Equipment Protection: Avoids equipment damage caused by sudden power outages, improving the equipment's service life and reliability.

Data Protection: Maintains power supply to the control system during power outages, preventing data loss and ensuring the safety of process parameters and operation data.

Stable Performance: In case of power fluctuations or instantaneous power outages, the UPS power supply can provide stable power, ensuring the continuity and stability of the coating process.

Purchase Information:

If you are interested in our magnetron sputtering coater, please contact us for more information and quotations.

Phone: +8618721621007

Email: Cheer@cysitech.com

Contact: Cheer

Whatsapp : +8618721621007

Technical Specifications:

 

Parameter

Specification

Product Name


Magnetron Sputtering Coater with UPS

Model

CY-MSH325-III-RFRFRF-UPS-SS

UPS


20KVA 16KW, with 1-hour delay, 16   batteries, 38AH capacity

Vacuum Chamber

Material 

Welded from 304 stainless steel, with   polished surface

Load/Unload Mode

Top-open cover for sample and target   loading/unloading

Observation Window

100mm diameter vacuum window with   magnetic shield to prevent contamination

Sample Stage

Sample Size

Suitable for flat samples with diameter   ≤150mm

Adjustable Target-Substrate Distance

Electrically adjustable

Rotation Speed

Non-rotating or rotating type (0-30RPM)

Heating Temperature

RT to 500°C, RT to 800°C, or RT to 1000°C

Magnetron Target

Target Gun Type

Ordinary magnet or strong magnet,   adjustable angle

Target Size

25mm (Note: If the   target is a magnetic material like Fe, Co, Ni, thickness should not exceed   1.5mm, requiring a strong magnet sputtering gun which needs to be purchased   separately)

Sputtering Power

500W*3

Sputtering Mode

DC sputtering and RF sputtering

Working Vacuum

0.3-3Pa

Sputtering Gas

High purity argon, nitrogen, oxygen, and   other inert gases (purity 99.99%)

Vacuum Measurement

Composite vacuum gauge (resistance gauge   + ionization gauge), measurement range: 105-10-5Pa

Vacuum Pumping

Fore Pump

Pumping speed 16L/S

Molecular Pump

Pumping speed 1200L/S

Film Thickness Measurement

Standard with CYKY film thickness gauge

 Optional   imported brand at extra cost

Exterior Dimensions

1190x1015x1535mm

Packaging Dimensions

1195x1020x1540mm, 800x620x615mm

Packaging Weight

500kg

Main Components:

Name

Components Description

Main Unit

Vacuum coating chamber size: Ø300*350 mm;   material: SUS304 stainless steel; three magnetron target positions; open-top   structure; electro-polished surfaces inside and out.

Water Chiller

1 set

Molecular Pump Set

1 set (molecular pump and control system)

Dual-stage Rotary Vane Pump

1 set

Test Target

2-inch test target

Accessories

Air compressor, corrugated hose,   necessary valves for installation

Manual

Included

Application Fields:

The magnetron sputtering coater with UPS is suitable for:

  1. Semiconductors: For the preparation of integrated circuits and microelectronic device functional  films.

  2. Optoelectronics: Suitable for   film deposition in optoelectronic devices such as photovoltaic cells and   LEDs.

  3. Display Technology: Widely used in LCDs, OLED displays, etc.

  4. Surface Engineering: For  surface modification and coating of metals, ceramics, plastics, etc.

  5. Multilayer Coatings: Preparing   multilayer PTFE films and ceramic films on glass substrates.

Application Example: Process Steps for Coating Multilayer PTFE and Ceramic Films on Glass Using the Magnetron Sputtering Coater with UPS

Preparation:

    1. Clean Substrate: Thoroughly   clean the glass substrate with solvents such as isopropanol to remove grease and contaminants.

    2. Dry Substrate: Dry the  substrate in a clean environment to prevent secondary contamination.

Equipment Setup:

    1. Load Substrate: Place the cleaned  glass substrate into the sputtering chamber and secure it on the  substrate holder.

    2. Vacuum Pumping: Start the  vacuum pump to reduce the pressure in the sputtering chamber to the required vacuum level (usually 10^-6 Torr or lower).

Magnetron Sputtering: Metal Target Deposition:

    1. Select Target Material: Use chromium or titanium as the initial adhesion layer target material.

    2. DC Sputtering: Set the DC  power supply to an appropriate power level (e.g., 200W) and begin  sputtering deposition. The time is controlled from a few minutes to ten   minutes, depending on the desired adhesion layer thickness.

Magnetron Sputtering: PTFE Film Deposition:

    1. Switch to RF Sputtering:   Select the PTFE target, set the RF power supply to a power level   typically between 100-200W.

    2. Adjust Gas Flow: Introduce   argon as the working gas, with a flow rate controlled between 10-20 sccm.

    3. Control Pressure: Maintain the chamber pressure between 1-3 mTorr.

    4. Deposition: Start RF  sputtering, with deposition time controlled from 30 minutes to several  hours, depending on the desired film thickness.

Magnetron Sputtering: Ceramic Film Deposition:

    1. Select Ceramic Target: Use   materials such as Al2O3 or SiO2.

    2. Set Power Supply: Choose DC  or RF sputtering based on the ceramic material, with power settings between 100-300W.

    3. Deposition Parameters:   Maintain the same gas flow and pressure, adjusting the deposition time to  achieve the desired ceramic film thickness.

Building Multilayer Structures with Alternating Deposition:

    1. Alternate Deposition: According   to design requirements, switch between PTFE and ceramic targets,   repeating steps 4 and 5.

    2. Monitor and Adjust: Real-time   monitoring of film thickness and deposition rate, making necessary adjustments.

Final Steps:

    1. Vent Chamber: After  deposition, gradually introduce nitrogen or other inert gases to slowly return to atmospheric pressure.

    2. Remove Substrate: Carefully  remove the coated glass substrate, avoiding contact with the coating surface.

Post-Processing (if needed):

    1. Annealing: Depending on the material  properties, choose an appropriate annealing temperature and time (e.g.,  annealing at 400°C for 1 hour) to enhance film adhesion and performance.

    2. Quality Inspection: Use  microscopes, X-ray diffraction (XRD), scanning electron microscopes  (SEM), etc., to check the coating quality and ensure it meets the   requirements.

Following these detailed steps, you can successfully deposit high-quality multilayer PTFE and ceramic films on glass substrates.

Common Issues:

  1. Can it be customized? Yes, the   number, size, and chamber dimensions of the target guns can be customized   according to requirements.

  2. Do you provide on-site installation and training services? Yes, we offer on-site installation and technical training  services to ensure users can operate the equipment proficiently.


Contact Us
  • E-mail: cysi@cysi.wang
  • Tel: +86 371 5519 9322
  • Fax: +86 371 8603 6875
  • Add: No. 820, 8th Floor, 1st Unit, 9th Block, Cuizhu Street, High-Tech Zone, Zhengzhou, Henan, China




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