High Vacuum Magnetron Sputtering Coater can be used to prepare single or multilayer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, etc
The magnetron sputtering coater is an advanced physical vapor deposition (PVD) equipment widely used in semiconductors, optoelectronics, display technology, and surface engineering. This equipment adopts magnetron sputtering technology, which enhances ionization efficiency through a magnetic field to achieve high-quality and uniform film deposition. The magnetron sputtering coater with UPS is a high-cost-performance equipment independently developed by our company, featuring standardization, modularization, and customization. It can protect against power outages, ensure continuous stable operation, and is particularly suitable for environments with unstable current voltage or continuous temperature requirements. This equipment can be used to prepare single or multilayer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, etc. The three targets can meet the needs of multilayer coatings. Compared to similar equipment, the three-target magnetron sputtering coater not only has a wide range of applications but also features a small volume and easy operation. It is an ideal device for laboratory material film preparation. The built-in UPS can avoid experimental interruptions caused by power outages, making it more stable.
Product Features:
Power Outage Prevention: During a power outage, the UPS power supply can provide continuous power, ensuring normal operation and preventing production interruptions and losses.
Equipment Protection: Avoids equipment damage caused by sudden power outages, improving the equipment's service life and reliability.
Data Protection: Maintains power supply to the control system during power outages, preventing data loss and ensuring the safety of process parameters and operation data.
Stable Performance: In case of power fluctuations or instantaneous power outages, the UPS power supply can provide stable power, ensuring the continuity and stability of the coating process.
Purchase Information:
If you are interested in our magnetron sputtering coater, please contact us for more information and quotations.
Phone: +8618721621007
Email: Cheer@cysitech.com
Contact: Cheer
Whatsapp : +8618721621007
Technical Specifications:
Parameter | Specification | |
Product Name | Magnetron Sputtering Coater with UPS | |
Model | CY-MSH325-III-RFRFRF-UPS-SS | |
UPS | 20KVA 16KW, with 1-hour delay, 16 batteries, 38AH capacity | |
Vacuum Chamber | Material | Welded from 304 stainless steel, with polished surface |
Load/Unload Mode | Top-open cover for sample and target loading/unloading | |
Observation Window | 100mm diameter vacuum window with magnetic shield to prevent contamination | |
Sample Stage | Sample Size | Suitable for flat samples with diameter ≤150mm |
Adjustable Target-Substrate Distance | Electrically adjustable | |
Rotation Speed | Non-rotating or rotating type (0-30RPM) | |
Heating Temperature | RT to 500°C, RT to 800°C, or RT to 1000°C | |
Magnetron Target | Target Gun Type | Ordinary magnet or strong magnet, adjustable angle |
Target Size | 2~5mm (Note: If the target is a magnetic material like Fe, Co, Ni, thickness should not exceed 1.5mm, requiring a strong magnet sputtering gun which needs to be purchased separately) | |
Sputtering Power | 500W*3 | |
Sputtering Mode | DC sputtering and RF sputtering | |
Working Vacuum | 0.3-3Pa | |
Sputtering Gas | High purity argon, nitrogen, oxygen, and other inert gases (purity 99.99%) | |
Vacuum Measurement | Composite vacuum gauge (resistance gauge + ionization gauge), measurement range: 105-10-5Pa | |
Vacuum Pumping | Fore Pump | Pumping speed 16L/S |
Molecular Pump | Pumping speed 1200L/S | |
Film Thickness Measurement | Standard with CYKY film thickness gauge | |
Optional imported brand at extra cost | ||
Exterior Dimensions | 1190x1015x1535mm | |
Packaging Dimensions | 1195x1020x1540mm, 800x620x615mm | |
Packaging Weight | 500kg |
Main Components:
Name | Components Description | |
Main Unit | Vacuum coating chamber size: Ø300*350 mm; material: SUS304 stainless steel; three magnetron target positions; open-top structure; electro-polished surfaces inside and out. | |
Water Chiller | 1 set | |
Molecular Pump Set | 1 set (molecular pump and control system) | Dual-stage Rotary Vane Pump 1 set |
Test Target | 2-inch test target | |
Accessories | Air compressor, corrugated hose, necessary valves for installation | |
Manual | Included |
Application Fields:
The magnetron sputtering coater with UPS is suitable for:
Semiconductors: For the preparation of integrated circuits and microelectronic device functional films.
Optoelectronics: Suitable for film deposition in optoelectronic devices such as photovoltaic cells and LEDs.
Display Technology: Widely used in LCDs, OLED displays, etc.
Surface Engineering: For surface modification and coating of metals, ceramics, plastics, etc.
Multilayer Coatings: Preparing multilayer PTFE films and ceramic films on glass substrates.
Preparation:
Clean Substrate: Thoroughly clean the glass substrate with solvents such as isopropanol to remove grease and contaminants.
Dry Substrate: Dry the substrate in a clean environment to prevent secondary contamination.
Equipment Setup:
Load Substrate: Place the cleaned glass substrate into the sputtering chamber and secure it on the substrate holder.
Vacuum Pumping: Start the vacuum pump to reduce the pressure in the sputtering chamber to the required vacuum level (usually 10^-6 Torr or lower).
Magnetron Sputtering: Metal Target Deposition:
Select Target Material: Use chromium or titanium as the initial adhesion layer target material.
DC Sputtering: Set the DC power supply to an appropriate power level (e.g., 200W) and begin sputtering deposition. The time is controlled from a few minutes to ten minutes, depending on the desired adhesion layer thickness.
Magnetron Sputtering: PTFE Film Deposition:
Switch to RF Sputtering: Select the PTFE target, set the RF power supply to a power level typically between 100-200W.
Adjust Gas Flow: Introduce argon as the working gas, with a flow rate controlled between 10-20 sccm.
Control Pressure: Maintain the chamber pressure between 1-3 mTorr.
Deposition: Start RF sputtering, with deposition time controlled from 30 minutes to several hours, depending on the desired film thickness.
Magnetron Sputtering: Ceramic Film Deposition:
Select Ceramic Target: Use materials such as Al2O3 or SiO2.
Set Power Supply: Choose DC or RF sputtering based on the ceramic material, with power settings between 100-300W.
Deposition Parameters: Maintain the same gas flow and pressure, adjusting the deposition time to achieve the desired ceramic film thickness.
Building Multilayer Structures with Alternating Deposition:
Alternate Deposition: According to design requirements, switch between PTFE and ceramic targets, repeating steps 4 and 5.
Monitor and Adjust: Real-time monitoring of film thickness and deposition rate, making necessary adjustments.
Final Steps:
Vent Chamber: After deposition, gradually introduce nitrogen or other inert gases to slowly return to atmospheric pressure.
Remove Substrate: Carefully remove the coated glass substrate, avoiding contact with the coating surface.
Post-Processing (if needed):
Annealing: Depending on the material properties, choose an appropriate annealing temperature and time (e.g., annealing at 400°C for 1 hour) to enhance film adhesion and performance.
Quality Inspection: Use microscopes, X-ray diffraction (XRD), scanning electron microscopes (SEM), etc., to check the coating quality and ensure it meets the requirements.
Following these detailed steps, you can successfully deposit high-quality multilayer PTFE and ceramic films on glass substrates.
Can it be customized? Yes, the number, size, and chamber dimensions of the target guns can be customized according to requirements.
Do you provide on-site installation and training services? Yes, we offer on-site installation and technical training services to ensure users can operate the equipment proficiently.
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