3-Inch Magnetron Sputtering Coater System for Gold film

The 3-inch magnetron sputtering Coater system is mainly used for preparing large-sized single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and more. Compared with similar equipment, this sputtering system is not only versatile but also compact and easy to operate, making it an ideal device for preparing large-sized films.

Magnetron sputtering Coater Features：

Efficient Coater: Utilizing magnetron sputtering technology, it offers high deposition rates and excellent film uniformity.

Multi-functional Application: Supports various target and substrate materials, suitable for depositing films of different materials.

Intelligent Control: Equipped with an advanced control system for precise process parameter control.

Modular Design: Easy to maintain and upgrade, with customizable functional modules as per requirements.

Eco-friendly: Low energy consumption design reduces environmental impact. 

Magnetron sputtering Coater Information:

If you are interested in our magnetron sputtering Coater system, please contact us for more information and a quote.

Phone: 156 3719 8390

Email: shirley@cysitech.com

Contact Person: Shirley

WeChat: 18736046549 

Magnetron sputtering Coater Technical Parameters:

The main components：

  Applications: 

1. Optical Films: Manufacturing anti-reflection Coaters, reflective Coaters, optical filters, etc.

2. Electronics and Semiconductors:

   - Manufacturing integrated circuits and electronic components, including resistors and capacitors.

   - Metalization processes for semiconductor devices, such as aluminum and copper conductive films.

3. Hard Coaters:

   - Creating hard Coaters for industrial tools like cutting tools and molds, such as TiN and TiC, to enhance hardness and wear resistance.

4. Magnetic Materials:

   - Manufacturing magnetic recording media like hard drives and magnetic heads.

5. Decorative Coaters:

   - Producing decorative Coaters for items like watches, jewelry, and eyeglass frames to provide color and corrosion resistance.

6. Protective Coaters:

   - Manufacturing protective Coaters like anti-corrosion, anti-oxidation, and wear-resistant Coaters for metal parts.

7. Energy Materials:

   - Deposition of films for energy devices such as solar cells and fuel cells.

8. Sensors:

   - Manufacturing sensitive films for various sensors, including gas sensors and biosensors.

 Application Case Study (Gold Coater on a Collector's Edition Record Using Magnetron Sputtering) 

Detailed Steps: 

Materials and Equipment Needed:

1. Magnetron Sputtering Coater System: For sputtering gold atoms onto the record surface to form a gold film.

2. Gold Target:

   - Specifications: Purity 99.99%, diameter 4 inches, thickness 0.125 inches.

   - Purpose: Source material for sputtering gold atoms onto the record surface.

3. Vacuum System: Maintains high vacuum in the Coater chamber to minimize interference from air molecules.

4. Argon (Ar) Gas:

   - Purity: 99.999%

   - Purpose: Working gas for generating plasma, argon ions bombard the target material causing sputtering.

5. Gas Flow Controller: Precisely controls the flow rate of argon gas.

6. Electronic Control System: Controls power parameters (such as power, voltage, current) during the sputtering process.

7. Cleaning Equipment:

   Ultrasonic Cleaner: Cleans the record surface, removing dust and oil.

   Lint-Free Cloth: Further cleans the record surface. 

Classic Parameters:

1. Vacuum Degree:

   - Pre-vacuum: Below 10-3 Pa

   - Working Pressure: 0.1-3 Pa (argon atmosphere)

2. Sputtering Power Parameters:

   - Power: 50-200 watts (adjust based on equipment and target specifications)

   - Voltage: 400-800 volts

   - Current: 0.1-0.5 amps

3. Gas Flow Rate:

   - Argon Flow Rate: 20-40 sccm (standard cubic centimeters per minute)

4. Sputtering Time:

   - Coater Thickness 0.1-0.5 microns: 10-30 minutes (adjust based on specific experiment conditions) 

Operational Steps:

1. Preparation:

   Clean the Record: Use an ultrasonic cleaner and lint-free cloth to remove dust and oil from the record surface, ensuring it is free of impurities.

   Prepare the Target: Install the gold target in the magnetron sputtering Coater system's target position, ensuring the target surface is clean. 

2. Set Up the Coater System:

   Install the Record: Secure the cleaned record on the Coater system's sample stage, ensuring it is stable and exposed to the sputtering area.

   Vacuum Processing: Start the vacuum system, gradually evacuating air from the Coater chamber until the required vacuum degree is achieved (usually below 10-3 Pa). 

3. Gas Flow Control:

   Introduce Argon Gas: Use the gas flow controller to introduce argon gas, maintaining the appropriate working pressure (0.1-3 Pa). 

4. Magnetron Sputtering Process:

   Pre-sputtering Cleaning: Before starting the actual Coater, perform pre-sputtering cleaning by activating the magnetron sputtering system to let argon ions bombard the gold target surface for about 5 minutes to remove the oxide layer and impurities.

   Adjust Power: Set the power parameters of the magnetron sputtering system (power 50-200 watts, voltage 400-800 volts, current 0.1-0.5 amps), activate the power to initiate the sputtering process.

   Coater: Gold atoms deposit on the record surface, forming a uniform gold film. Adjust the sputtering time (10-30 minutes) based on the desired film thickness. 

5. Completion and Post-Processing:

   Stop Sputtering: When the desired film thickness is reached, turn off the power to stop the sputtering process.

   Release Vacuum: Slowly introduce air to return the chamber pressure to normal.

   Remove the Record: Carefully remove the coated record, avoiding touching the coated surface.

   Post-Processing: Perform necessary post-processing, such as annealing, to improve the adhesion and stability of the gold film. 

Precautions:

Safety: Ensure to wear appropriate protective equipment, such as gloves and goggles, during operation.

Parameter Control: Precisely control all parameters during the sputtering process to ensure Coater quality.

Equipment Maintenance: Regularly maintain and calibrate the equipment to ensure the normal operation of the Coater system.